For the next generation of flagships, the Chinese company would have chosen a completely different approach from the usual strategy. The pair of top-of-the-line models will see the addition of vivo X500 Pro Max, the true flagship model of the family.
However the changes will not be limited to technical and photographic ones: the standard phone of the series would have a different design from its bigger brothers, almost to firmly emphasize that they are different devices from one another.
Fans of the classic aesthetic of the X series may have a lot to complain about: the usual central circular island that characterizes the lineup would be exclusive to the vivo X500 Pro and Pro Max.
The base version vivo X500 should change its look by introducing a circular camera module placed in the top-left corner of the chassis. Consequently, the island should be smaller than usual.
The smartphone would have, for its part, a flat screen with a diagonal of 6.59″, and would be the mid-range model of the family (in terms of size). The role of the compact flagship would belong to X500 Pro with its 6.37″, while the Pro Max model would be the giant at 6.85″.
It would also change the heart of each device: the Dimensity 9600 Pro at 2 nm would be reserved for the higher-end siblings, while the vivo X500 would have the Dimensity 9000 on board in the vanilla version (manufactured at 3 nm). At the moment MediaTek has not yet confirmed the new SoCs, so it will be necessary to wait at least until September.
The current vivo X300 lineup was launched last October, at the beginning of the month in China and in Italy toward the end. This year there are rumors of an early debut, at least as far as the Chinese market is concerned: the launch event is expected to take place as early as September, a particularly busy period between Apple news and the Android world.
Certo, te la rendo come tabella normale, non come codice:
| Features | vivo X500 | vivo X500 Pro | vivo X500 Pro Max |
|---|---|---|---|
| Dimensions and weight | / | / | / |
| Colors | / | / | / |
| Certification | IP68/IP69 | IP68/IP69 | IP68/IP69 |
| Display | Flat AMOLED LTPO 6.58″ 1.5K (2,643 x 1,220 pixels), refresh rate 120 Hz | Flat AMOLED LTPO 6.37″ 1.5K, refresh rate up to 144 Hz | Flat AMOLED LTPO 6.85″ 2K, refresh rate 144 Hz |
| Security | Under-display fingerprint reader (ultrasonic) | Under-display fingerprint reader (ultrasonic) | Under-display fingerprint reader (ultrasonic) |
| Cooling | Liquid cooling with vapor chamber | Liquid cooling with vapor chamber | Liquid cooling with vapor chamber |
| SoC | MediaTek Dimensity 9600, 3 nm TSMC | MediaTek Dimensity 9600 Pro, 2 nm TSMC | MediaTek Dimensity 9600 Pro, 2 nm TSMC |
| CPU | / | / | / |
| GPU | / | / | / |
| RAM | LPDDR5X Ultra | LPDDR6 | LPDDR6 |
| Storage | UFS 4.1 non-expandable | / | / |
| Battery | 7,500 mAh | Approx. 6,500/6,600 mAh in prototypes, possible final version close to 7,000 mAh | Approx. 8,000 mAh |
| Charging | / | / | Wired and wireless fast charging |
| Camera | Triple, 50 + 64 MP (1/1.28″): OIS, periscopic telephoto and ultrawide, ZEISS lenses | Triple, 50 + 50 + 64 MP: main 1/1.28″ with LOFIC technology, ultrawide and periscopic telephoto, ZEISS lenses | Triple, 50 + 50 + 200 MP: main Sony 1/1.28″ with LOFIC technology, Sony ultrawide and 1/1.4″ periscopic telephoto, telemacro, ZEISS lenses |
| Selfie camera | / | 68 MP Sony, in testing | 68 MP Sony, in testing |
| Connectivity and other features | Dual SIM 5G, Wi‑Fi 7, Bluetooth, NFC, Dual GPS, stereo speakers, USB-C 3.2 Gen 1, IR sensor | Dual SIM 5G, Wi‑Fi 7, Bluetooth, NFC, Dual GPS, stereo speakers, USB-C 3.2 Gen 1, IR sensor | Dual SIM 5G, Wi‑Fi 7, Bluetooth, NFC, Dual GPS, stereo speakers, USB-C 3.2 Gen 1, IR sensor |
| Operating System | Android 17 with OriginOS 7 | Android 17 with OriginOS 7 | Android 17 with OriginOS 7 |
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