The latest rumors about Lei Jun’s company come from Indian insider Yogesh Brar, a figure who has proven reliable on several occasions. According to reports, Xiaomi is at work on a mysterious smartphone Ultra, still unnamed. The device would have, on its side, the brand’s new proprietary chipset, still unreleased, namely the much-talked-about XRING O3.
The SoC is expected in the coming months, and just recently a substantial leak has teased several details. Based on what has emerged, Xiaomi would have implemented a new three-cluster configuration, with a maximum frequency of 4.05 GHz: we are talking about a significant step forward compared to the predecessor, both in terms of architecture and performance.
However the first smartphone with XRING O3 should be the brand’s next foldable, known as Xiaomi 17 Fold. The company would have already bid farewell to the MIX series, canceling both MIX Fold 5, and MIX Flip 3 and MIX 5 vanilla.
Consequently this unreleased Xiaomi Ultra should arrive after the foldable; the source claims that it could have to do with the upcoming Xiaomi 18 Ultra (set to arrive in its home country by the end of the year), but it’s not clear how it will fit alongside the latter.
Perhaps the key to it all lies in the next leak: the device would be expected to ship only in China and no Global variant is planned. At this point we can make a guess: Lei Jun’s company will launch the 17 Fold model to show the public the potential of the new chipset; with the next-generation flagship, the classic Camera Phone will be joined by another Ultra smartphone.
Two Ultra flagships, one with Snapdragon and one with XRING O3, with the latter limited to the Chinese market. It could be a golden opportunity to showcase the capabilities of the proprietary SoC against Qualcomm’s flagship solution.
Clearly this is a hypothetical scenario and the final word always rests with Xiaomi: there’s nothing left but to await further news about the mysterious Ultra with XRING, coming soon.
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