A few days ahead of the launch in China, scheduled for September 28, the first rumors about the specs of the entire HONOR Magic 9 lineup have started circulating online, which, according to leakers Smart Pikachu and Digital Chat Station, would consist of three distinct variants: the base model, the Pro Max, and a new Super Power Edition oriented toward performance.
The base Magic 9 model would feature a 6.37″ display with slightly narrower bezels than the Pro Max, an 8,000 mAh battery and a 200 MP ARRI dual camera (main and 1/1.56″ periscope telephoto). The chipset would be the Magic 8 and 8 Pro, paired with an in-display ultrasonic fingerprint sensor and a unibody glass chassis.
The Pro Max model would stand out for a larger display of 6.8″, featuring the Black Diamond Screen technology for deeper blacks and a brighter visual experience, which is absent on the base model.
The battery would rise to 8,800 mAh, while the 200 MP ARRI dual camera would remain. What would make the difference would be especially the chipset: the Magic 9 Pro Max would mount the new Snapdragon 8 Elite Gen 6, which will be announced by Qualcomm on September 22.
On the security front, it could introduce 3D facial recognition with a dual square sensor (1:1 configuration).
The third variant, the Super Power Edition, would focus entirely on endurance: the same 6.8″ display as the Pro Max but with a 165 Hz refresh rate, a robust 11,000 mAh battery and an active cooling system (with an integrated fan), all housed in a fiberglass chassis.
The camera setup would differ from the other two variants, with a 50 MP sensor complemented by a 12 MP camera and a second 50 MP camera. The chipset would return to being the Snapdragon 8 Elite Gen 5, the same as the base model.
For all the latest news about the brand’s ecosystem, you can find our most recent articles in GizChina.it’s HONOR section.
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