Mixed reality is set for an upgrade, Qualcomm teases new features

The standalone headset sector is preparing to welcome a major update. Qualcomm, the leading processor manufacturer for this specific market segment, has recently piqued the curiosity of enthusiasts and industry professionals by publishing a short video on platform X.

The promotional video explicitly references a ‘new reality‘, an unmistakable sign of the arrival of an unrevealed hardware component destined for next-generation headsets.

At the moment, the official naming of the next chip remains uncertain: the American company could unveil a completely new Snapdragon XR3 platform, or reveal a third generation of the well-known XR2 series. What is evident is the intention to boost performance for wearable devices.

Qualcomm teases fans, Snapdragon XR3 on the way?

Trying to predict an exact date for the official unveiling proves quite complex, considering that the Californian company has never followed a rigid schedule for these debuts.

Looking at the brand’s history, the Snapdragon XR1 model was unveiled at the AWE in May 2018, while the subsequent XR2 appeared during the Snapdragon Tech Summit in December 2019. More recently, the variant XR2 Gen 2 debuted just before the Quest 3 launch in 2023, and the XR2+ Gen 2 version previewed CES 2024.

The most probable time windows for the new announcement are essentially two: the investor relations meeting scheduled for June 24, where new details on hardware collaborations could emerge, or the Snapdragon Summit at the end of September.

This latter appointment is particularly interesting as it takes place in conjunction with the Connect event organized by Meta.

Analyzing the moves of the leading headset manufacturers, corporate strategies are taking different directions. On one hand, Meta has so far hinted at the arrival of new smart glasses, devices that historically integrate Qualcomm’s Snapdragon AR1 processors.

The company is also reportedly working on a slim and lightweight standalone hardware connected to an external module, currently known by the codename “Phoenix“, whose launch would, however, be pushed to 2027.

On the other hand emerges the figure of Pico, a company owned by ByteDance, which appears as the ideal candidate to promptly adopt the new silicon architecture.

The headset in development, known as Project Swan and expected for a global launch toward the end of 2026, boasts notable potential.

According to rumors circulated last March, this hardware will be equipped with a top-of-the-line processor capable of delivering performance more than double, on both CPU and GPU fronts, compared to the current standard offered by the Snapdragon XR2 Gen 2.