Pixel 11, new leaks reveal interesting hardware details

An important and massive leak has just revealed almost all the crucial details regarding the upcoming Pixel 11 series. According to information recently released by Mystic Leaks, a source that did not hesitate to describe these data as explosive, we are looking at an almost complete overview of the next flagship line from Google.

If the rumors prove accurate, the California-based company is preparing to introduce significant changes under the hood, while maintaining a strong aesthetic continuity with the previous Pixel 10 series. The launch of the new devices, according to current plans, is expected for the month of August.

Pixel 11 Series, all the new details leaked

At the center of the discussions is the new processor Tensor G6. This updated chip will operate through a structured configuration in a 1+4+2 scheme, leveraging the latest architectures ARM C1. To accompany this computational component we will find a GPU PowerVR C-Series CXTP-48-1536, in addition to the new proprietary security chip Titan M3.

The perhaps most relevant aspect of these revelations concerns the connectivity department. It seems that Google is ready to end its long-standing collaboration with Samsung regarding Exynos modems, opting instead for a component MediaTek M90, also known by the code MT6986D.

Chip-related novelties also include a new TPU dedicated to advanced computing operations and a new GXP, i.e., the image signal processor (ISP) completely customized by the Mountain View-based company.

The presence of a new image processor is closely tied to the updates in the hardware for cameras, a sector where the American company makes changes to components in a very measured way.

The base Pixel 11 model, together with the foldable variant Pixel 11 Pro Fold, is expected to host a new main sensor identified by codename “chemosh“, with an estimated resolution of 50 MP.

For the higher-end size and performance versions, i.e., the Pixel 11 Pro and the Pixel 11 Pro XL, the leaks suggest adopting two sensors never seen before named “bastet” and “barghest“.

These elements will handle respectively the main camera and the telephoto lens. Although the exact technical specifications of these modules remain unknown, the decision to update the camera modules so markedly represents a very interesting move.

	Google Pixel 11	Google Pixel 11 Pro	Google Pixel 11 Pro XL	Google Pixel 11 Pro Fold
Display	6,3″, 1.080×2.424 pixel, 60–120 Hz, 240 Hz PWM, 2.200 nit	6,3″, 1.280×2.856 pixel, 1–120 Hz, 240 Hz PWM, 2.450 nit	6,8″, 1.344×2.992 pixel, 1–120 Hz, 240 Hz PWM, 2.450 nit	Internal: 2.076×2.160 pixel, OLED, 1–120 Hz, 2.050 nit External: 1.080×2.342, OLED, 60–120 Hz, 2.450 nit
Battery	4.840 mAh (minimum capacity)	4.707 mAh (minimum capacity)	5.000 mAh (minimum capacity)	4.658 mAh (minimum capacity)
RAM	8GB/12GB	12GB/16GB	12GB/16GB	12GB/16GB
Colors	Black, Green, Pink, Purple	–	–	–

Farewell to the temperature sensor and introduction of Pixel Glow

The leaked documents go beyond the chips and photography, foreshadowing some design choices that could characterize the back shell of smartphones.

The integrated temperature sensor, which had appeared on previous Pro models, will apparently be removed. In its place, on the distinctive horizontal band housing the cameras, will debut a system called “Pixel Glow”.

It is described as a mechanism very similar to the Glyph interface used on Nothing-branded devices, based on small LED indicators placed strategically next to the flash.

Finally, the leaked information confirms that the hardware for the new generation facial recognition, internally known as “Project Toscana“, is not ready for launch. This specific implementation will not see the light on the Pixel 11 series, leaving users waiting for future evolutions in biometric unlocking.