The debut of the Galaxy S27 series is expected in the early months of 2027, but rumors about the South Korean company’s design choices already outline a rather complex situation.
The global tech sector is facing a severe crisis tied to the surge in DRAM memory prices, a dynamic that is pushing many manufacturers to rethink their plans.
To prevent the price increases from spilling over into the final selling price of smartphones, Samsung finds itself forced to weigh various concessions. Among the most recent rumors is the possibility that the base models of the upcoming lineup will adopt OLED panels manufactured by BOE, a purely economical choice.
However, the most significant changes will concern the Exynos 2700 processor, which, although based on the advanced second-generation 2 nm GAA manufacturing process, may have to give up crucial packaging technologies.
Exynos 2700, a 2 nm chip but no FOWLP packaging
To contain production costs, the Asian company is seriously considering eliminating the FOWLP technology, acronym for Fan-Out Wafer-Level Packaging. This approach, first introduced on the Exynos 2400, allows for smaller, thinner, and faster chipsets by placing the electrical circuits outside the processor die area.
The use of FOWLP enables integrating a greater number of input and output connections in an extremely small space, significantly improving thermal resistance and, consequently, sustained performance over time.
Considering the historical tendency of Exynos processors to generate high temperatures, with a consequent reduction in operating frequencies, the use of this particular technology seems essential. Nevertheless, the exorbitant costs reached by RAM memory force drastic decisions to keep the device competitive on the market.
Alternative solutions for thermal management
Abandoning advanced packaging could expose the Exynos 2700 to a greater risk of overheating, compromising its overall efficiency.
To curb this problem, South Korean engineers are evaluating the adoption of the so-called SBS architecture, i.e., “side-by-side”. This solution involves placing the processor and the DRAM memory side by side on the same substrate, facilitating the installation of a shared and optimized heat dissipation system for both components.
Since memory chips can also reach critical temperatures during intensive use scenarios, this joint implementation would help delay the SoC’s entry into the critical thermal threshold, curbing throttling. This is a technical measure aimed at balancing the loss of FOWLP, in an attempt to preserve a stable user experience.
Strategic and economic implications
The final decision has not yet been made, but the implications of these choices go far beyond the mere technical specifications of a smartphone. The real capabilities and the actual adoption of the Exynos 2700 within the Galaxy S27 family will determine the speed of recovery of Samsung’s semiconductor division not tied to memory.
Any evident performance drop could impact consumer trust in a highly competitive market.
Nevertheless, there are several corporate strategies to support the processor division. If removing the more costly packaging technologies will allow keeping the future lineup within appropriate price ranges, avoiding alienating customers, the technical compromise will prove to be a justified and necessary move.
