Samsung Exynos 2700: LPDDR6, UFS 5.0, and many more juicy details leaked

While the tech world is still digesting the novelties of the chip Exynos 2600, intended to equip the Galaxy S26 and S26+ in selected markets, attention has already decisively moved further into the future.

Although the current generation has introduced interesting solutions, such as a copper heatsink directly attached to the application processor (AP), it is not immune to defects.

It is precisely in this context of continuous refinement that the first rumors about the future Exynos 2700, expected for 2027, have emerged.

According to what has been reported by an anonymous but credible source, tied to trustworthy Samsung leakers, the new SoC, internally identified with the codename “Ulysses”, promises to make enormous strides.

Samsung Exynos 2700: SF2P process and new ARM architecture

Exynos 2700 will be forged using the SF2P manufacturing process of Samsung. It is the direct evolution of the technology at 2-nanometer GAA (Gate-All-Around) already seen on the current model.

For the less experienced, the GAA technology represents a 3D transistor architecture in which the gate surrounds the channel on all four sides, ensuring superior electrostatic control and a lower voltage threshold.

The expectations for this new process are high: an estimated 12% increase in raw performance accompanied by a 25% reduction in overall energy consumption compared to the SF2 node.

This technological advancement will allow the main core to reach operating frequencies of 4.20 GHz, a clear step forward from the 3.90 GHz (or 3.80 GHz according to some rumors) of Exynos 2600.

The chip will almost certainly use the new ARM Cortex-C2 cores, which will likely be marketed under the new naming C2-Ultra and C2-Pro. Although the exact cluster configuration has not been confirmed, it is plausible that Samsung keeps the 1+3+6 architecture, while aiming for an IPC gain of about 35%.

Benchmark teorici, dissipazione e memorie

The performance projections paint an exciting picture. Thanks to the higher clock speed and the new core architecture, the Exynos 2700 could reach theoretical Geekbench 6 scores of 4,800 in single-core and 15,000 in multi-core.

If these data were confirmed in reality, we would be looking at an increase of 40% and 30%, respectively compared to the Exynos 2600, positioning the chip as a formidable competitor in the premium segment.

Perhaps the most revolutionary aspect emerging from the leaks concerns packaging engineering. The Exynos 2700 should adopt the FOWLP-SbS packaging technology (Side-by-Side), which integrates a unified block for the thermal path (Heat Path Block).

Unlike the current implementation, where the heatsink covers only partially the processor, the new HPB in copper would cover the entire surface of the AP and the DRAM memory. This approach would guarantee extremely efficient heat dissipation, essential to keep the high operating frequencies described above stable.

To support this computing power, the SoC will be accompanied by next-generation memories. It explicitly mentions support for LPDDR6 and storage UFS 5.0.

The LPDDR6 RAM, in particular, will support a throughput up to 14.4 Gbps. This increased bandwidth will be crucial to feed the GPU Xclipse based on AMD architecture, which is expected to benefit from a boost between 30% and 40%.

Ancora molte incognite

Despite the wealth of details, there remain some unknowns, given the time until the official launch.

It is not yet clear, for example, whether Samsung will opt for an integrated or external modem. Although external modems are generally less efficient, they simplify the AP manufacturing process and improve production yields.

In addition, there are tangential rumors that Samsung could move to a proprietary GPU with Exynos 2800, potentially making the Exynos 2700 the last major exponent of the AMD collaboration on this scale.