REDMAGIC 11 Air: What to Expect from the New Gaming Phone

The launch of the new Gaming Phone from the Chinese brand is drawing nearer: the company has begun teasing with the first official teaser, which simply reminds us that the debut is almost around the corner.

Currently the company hasn’t revealed anything else, but don’t worry because the TENAA regulatory body is more than enough: not only has it published the specifications of REDMAGIC 11 Air but it also offers an overview of the design.

REDMAGIC 11 Air: the first official teaser reminds us that the release is near

redmagic 11 air
Credits: REDMAGIC

As for the official poster, there is only confirmation of the name REDMAGIC 11 Air: the launch is scheduled during the January month, so it’s only a matter of time before social profiles begin to offer additional details.

Most likely the device will also arrive in Italy: the predecessor found space in Global markets, so the same should happen with the new model.

What do we know about the upcoming affordable Gaming Phone

redmagic 11 air
Credits: TENAA

REDMAGIC 11 Air has been spotted on Geekbench with the codename NX799J: the platform “confirms” that the heart of the experience will be the Snapdragon 8 Elite, Qualcomm’s former flagship chipset. Meanwhile the phone has been certified again by TENAA; previously the agency’s database contained only the specifications but now there are the images.

The Gaming Phone’s design diverges from REDMAGIC 10 Air: no understated and not really "gaming" style but a chassis with a futuristic touch, in the brand’s perfect style. It isn’t to be ruled out that there will also be more minimalist colorways. Meanwhile the TENAA images seem to confirm the presence of the fan integrated, absent on the previous Air.

Below you will find all known specifications thanks to the Chinese certification body, while we remember that the SoC was unveiled by Geekbench.

  • Dimensions and weight: 163.82 x 76.54 x 7.85 mm, 207 g
  • Color options: /
  • Certification: /
  • Internal display: AMOLED BOE X10 6.85″ 1.5K (2,688 × 1,216 pixels) with 120 Hz refresh rate
  • Security: under-display fingerprint reader (optical or ultrasonic)
  • Liquid cooling with vapor chamber of 13.116 mm2, 10 layers and liquid metal + mini fan
  • SoC: Qualcomm Snapdragon 8 Elite, 3 nm TSMC
  • CPU: octa-core
    • 2 x 4.32 GHz – Oryon Phoenix L
    • 6 x 3.53 GHz – Oryon Phoenix M
  • GPU: Adreno 830
  • RAM: 12/16/24 GB LPDDR5T
  • Storage: 256/512 GB/1 TB UFS 4.1 Pro non-expandable
  • Battery: 7,000 mAh, i.e. 6,780 mAh nominal capacity
  • Charging: /
  • Camera: dual 50 + 8 (f/?) with OIS and ultra-wide
  • Selfie camera: 16 MP (f/2.0), under the display
  • Connectivity and others: Dual SIM 5G, Wi-Fi 7, Bluetooth 5.4, NFC, GPS dual-band, stereo speakers, USB-C, IR sensor, rear buttons
  • Operating system: Android 16 with REDMAGIC OS 11