After announcing its top-end chipset, MediaTek is preparing for the debut of the Dimensions 8200: the next SoC should see the light soon, also seen the debut on board an iQOO device. Now a Chinese insider sheds light on the technical specifications of the processor, revealing what appears to be (at least at first glance) a minor upgrade.
MediaTek Dimensity 8200: details on the specifications appear
The first smartphone (or one of the first) to have the next MediaTek SoC on board will be iQOO Neo 7 SE, although we don't currently have a release date yet. For what concern Dimensions 8200, the Chinese insider DigitalChatStation has anticipated the specifications of the chipset, which seems to offer a slight improvement over the current generation.
The Dimension 8100 is made up of a 4 x octa-core CPU 2,85 GHz Cortex-A78 + 4 x 2,0GHz Cortex-A55, one GPU Mali-G610 MC6 and support for LPDDR5 RAM memories. There is also a 5G Dual SIM modem, as well as Wi-Fi 6E and Bluetooth 5.3.
But what will be the novelties of the next Dimension 8200? According to the insider we will find the same configuration with four Cortex-A78 cores and four Cortex-A55, but with some changes. Precisely we should have an A78 at 3.1 GHz e three A78s at 3.0 GHz; the A55 cores will not change (all four at 2.0 GHz). Even the GPU should stay the same.
In short, MediaTek's new chipset should be more of a simple upgrade (albeit with more power) than a brand new solution.
Finally the leaker reports that the next ones Redmi e iQOO they will have the Dimensity 8200 on their side and will debut in a price range below €269 at the exchange rate (2000 yuan).⭐️ Discover the new Weekly Flyer of GizChina with always different exclusive offers and coupons.